By info@ico28.com 
Data centres currently account for over 2% of global energy consumption. With the rise of AI, this figure is predicted to increase to as much as 7% by 2030, which would be equivalent to the current energy consumption of India.
Efficient power conversion from grid to core is critical for achieving higher power densities, improving computing performance, and reducing total cost of ownership (TCO). In response, Infineon Technologies is introducing the TDM2354xD and TDM2354xT dual-phase power modules, which deliver top-tier power density for high-performance AI data centres. These modules enable true vertical power delivery (VPD) and lead the market with a current density of 1.6 A/mm², following the earlier release of the TDM2254xD modules.
“We are proud to enable high-performance AI data centers with our TDM2354xT and TDM2354xD VPD modules. These devices will maximize system performance with Infineon’s trademark quality and robustness, thereby enabling best TCO for data centers,” said Rakesh Renganathan, Vice President Power ICs at Infineon Technologies. “Our industry-leading power devices and packaging technologies, combined with our extensive systems expertise, will further advance high-performance and green computing as part of our mission to drive digitalization and decarbonization.”
The TDM2354xD and TDM2354xT modules incorporate Infineon’s durable OptiMOS 6 trench technology, a chip-embedded package that enhances power density through improved electrical and thermal efficiency, alongside a new inductor technology for a lower profile and true vertical power delivery. These innovations establish new benchmarks for power density and quality, maximising the efficiency and performance of AI data centres. The TDM2354xT modules can handle up to 160 A and are the first in the industry to feature Trans-Inductor Voltage Regulator (TLVR) technology in a compact 8 x 8 mm² form factor. Paired with Infineon’s XDP controllers, they deliver ultra-fast transient response and reduce on-board output capacitance by up to 50 percent, further increasing system power density.
These new modules will be showcased at Infineon’s global technology event, OktoberTech 2024, in Silicon Valley on 17th October, and at electronica 2024 in Munich from 12-14 November.
Original article source:
https://www.electronicspecifier.com/products/power/infineon-launches-power-modules-for-data-centres
FAQ
1.What are the names of the new power modules introduced by Infineon?
Infineon has launched two power modules specifically for AI data centers: the TDM2354xT and TDM2354xD. These modules are designed to meet the increasing power demands associated with artificial intelligence applications.
2.What technology do these power modules utilize?
The modules utilize Infineon’s OptiMOS 6 trench technology, which enhances both electrical and thermal performance. Additionally, they incorporate advanced inductor technology to support a more compact design, leading to improved power delivery efficiency.
3.What are the power handling capacities of these modules?
The TDM2354xT module is capable of handling currents up to 160 A, making it suitable for high-performance data center applications.
4.What is Trans-Inductor Voltage Regulator (TLVR) technology, and what benefits does it offer?
TLVR technology, which is included in the TDM2354xT module, allows for rapid transient response while reducing on-board output capacitance by up to 50%. This results in optimized power density and system performance.
5.How do these power modules contribute to sustainability efforts?
Infineon’s new modules are designed to improve efficiency and performance in data centers, supporting the industry’s goals of decarbonization and green computing.
6.When will these modules be available for purchase?
The modules will be showcased at Infineon’s OktoberTech 2024 event in Silicon Valley on October 17 and at the electronica trade fair in Munich from November 12-14.
7.Who are the primary users of these power modules?
These modules are targeted at operators of AI data centers looking to enhance system performance and reduce total cost of ownership (TCO).